About Us

Company established.

Successfully taped out optical computing chips with matrix scales of 25×25 and 50×50. First-generation optoelectronic co-packaged chip operational.

Launched optoelectronic fusion computing card DEMO (optical computing chip + electrical chip FPGA), initially validating optical computing product format.

Completed small-matrix optical computing chip optoelectronic co-packaging testing and electrical chip ASIC tape-out.

Successfully taped out the world's first 128×128 optical computing chip.

Completed mainstream algorithm testing for large-matrix optical computing chips.

Received strategic investment from a domestic internet giant.

Received investments from Shanghai and Suzhou state-owned funds.
Named to World Economic Forum's "Technology Pioneers" list at Davos.
Became a founding member of Shanghai Federation of Industry and Commerce AI Committee.
Recognized as Shanghai Specialized and Innovative SME.
Conducting scenario adaptation validation for first-generation optoelectronic fusion computing card and taping out 256×256 optical computing chip.

Conducting scenario adaptation validation for second-generation optoelectronic fusion computing card and taping out 512×512 optical computing chip.